Title: Describe the atomic structure and construction methods of semiconductors.
Course: Electronics Systems III (17106-III) > Section: Analyzing Microprocessors

Description should include

- atomic structure
  - identifying the number of protons and neutrons in the nucleus
  - creating a diagram of the number of electrons in each orbital
- definition of covalent bonding
- materials used
  - identifying pentavalent, trivalent, and pure semiconductor materials
  - providing an explanation of the doping process for creating N- and P-type semiconductor materials
- effects of temperature on semiconductor materials
- construction methods
  - identifying deposition, removal, patterning, and modification of electrical properties
- explanation of current flow and hole flow in semiconductor material.

Process/Skill Questions:

- What is the atomic structure of semiconductor material?
- What are some terms related to semiconductor construction?
- How are the electrical properties of semiconductor devices modified?
- How are semiconductor devices manufactured?
- What are the strengths and weaknesses of donor and acceptor impurities?
- What would happen if a negative temperature coefficient had no effect on semiconductor materials? What are the strengths and weaknesses of germanium and silicon semiconductors?
- What is the relationship between intrinsic and extrinsic material, with respect to donor impurities?
- What are the strengths and weaknesses of N-type and P-type semiconductor materials?
- How do pentavalent and trivalent materials compare, with respect to covalent bonding and majority/minority carriers?
- What is the purpose of doping?
- How do electron-hole pairs work?